James J. Licari,Dale W. Swanson's Adhesives Technology for Electronic Applications: Materials, PDF

By James J. Licari,Dale W. Swanson

ISBN-10: 0815515138

ISBN-13: 9780815515135

This e-book is exclusive in its accomplished assurance of all facets of adhesive know-how for microelectronic units and packaging, from concept to bonding to check strategies. as well as common functions, corresponding to dies, substrate, and lid and chip stack attachments, the ebook comprises new advancements in anisotropic, electrically conductive, and underfill adhesives. quick curing equipment similar to UV, microwave, and moisture (which conform to present environmental and effort specifications) are lined. Over eighty tables and a hundred and twenty figures offer a wealth of knowledge on homes, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and kit. each one bankruptcy presents entire references.

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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